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JORGE LOZANO Electronic Cooling Simulations using ANSYS ICEPAK Week 8 - Natural Convection-II Build the model as per the following information. Mesh the model with nonconformal meshing Solve the problem for natural convection. Panel dimensions: height 2000mm, width 800 mm depth: 900mm. Actual current incoming: 1214A.…
JORGE LOZANO
updated on 15 Nov 2021
JORGE LOZANO
Electronic Cooling Simulations using ANSYS ICEPAK
Week 8 - Natural Convection-II
Process
The process will be introduced from a new project document by opening the Icepak software, and starting to generate each block representing the system, fluid or solid, according to its coordinates and its properties given earlier, as seen in the image having an open system, having side boundary layers as ambient conditions.
As seen in the videos the mesh conforming conditions will begin by creating an assembly with the inner parts of the system and indicating the max mesh element size as 5 mm and a minimum gap of 0.1 in all directions, considering the approximation to a good or excellent quality mesh due to the skewness.
Once all preprocessing conditions and geometry are processed, the processing conditions will be selected, as follows having a parallel of 4 processors, transient simulation using a Zero equation turbulence model, applying gravity in the y- direction with the default discretization conditions.
By adding into the postprocessing configuration probe points to generate a monitor while running the simulation, helps determine the increment or variation and comparison of all components in critical or desired focus.
The contour, plane cut and vectors postprocessing are generated, seeing the natural convection effect from having a heated inner volume of air at 45 C and an ambient temperature of 20 C. Being able to see the velocity pattern that the air follows and the gradient in which the outer fluid is being heated.
Seeing the arrows’ direction where in flow inside the volume is moving and the effect of the density variation in the outer fluid.
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Week 9 - PCB Thermal Simulation
JORGE LOZANO Electronic Cooling Simulations using ANSYS ICEPAK PCB THERMAL SIMULATION A PCB board, library files, and traces are imported to create the model. The model is first solved for conduction only, without the components and then solved using the actual components with forced convection. Process Given…
16 Nov 2021 04:05 AM IST
Week 8 - Natural Convection-II
JORGE LOZANO Electronic Cooling Simulations using ANSYS ICEPAK Week 8 - Natural Convection-II Build the model as per the following information. Mesh the model with nonconformal meshing Solve the problem for natural convection. Panel dimensions: height 2000mm, width 800 mm depth: 900mm. Actual current incoming: 1214A.…
15 Nov 2021 06:25 PM IST
Week 7 - Mid-term Project - Natural Convection
JORGE LOZANO Electronic Cooling Simulations using ANSYS ICEPAK Week 7 - Mid-term Project Objective Verify the temperature rise for the low voltage control panel for the following configuration. Build the model as per the following information. Mesh the model with nonconformal meshing Panel dimensions: height 2000mm,…
15 Nov 2021 07:07 AM IST
Week 6.2 - Setting up a model (Hanging Node)
JORGE LOZANO Electronic Cooling Simulations using ANSYS ICEPAK Setting up a model (Hanging Node) A forced convection electronic simulation must be performed, generating postprocessing results from the simulation on a steady state condition. Process First the initial mesh generation must be performed, obtaining…
21 Sep 2021 05:36 AM IST
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