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JORGE LOZANO Electronic Cooling Simulations using ANSYS ICEPAK Week 7 - Mid-term Project Objective Verify the temperature rise for the low voltage control panel for the following configuration. Build the model as per the following information. Mesh the model with nonconformal meshing Panel dimensions: height 2000mm,…
JORGE LOZANO
updated on 15 Nov 2021
JORGE LOZANO
Electronic Cooling Simulations using ANSYS ICEPAK
Week 7 - Mid-term Project
Objective
The following image representation shows the general real assembly of breaks and an electrical connection.
The following parameters and considerations in dimensioning and power W, will be applied to generate a thermal simulation.
Geometry
The process will be introduced from a new project document by opening the Icepak software, and starting to generate each block representing the system, fluid or solid, according to its coordinates and its properties given earlier, as seen in the image having an open system, having side boundary layers as ambient conditions
Pre-processing
As seen in the videos the mesh conforming conditions will begin by creating an assembly normal mesh and particular mesh sizing refinements in all solid elements, considering the skewness as quality value to consider.
Residual
Once the simulation is completed at the specified iteration number:
Post-processing
The contour, plane cut and vectors postprocessing are generated, seeing the natural convection effect from having heated breaks generating power, a forced simulation was performed varying the inlet position which was where it could cool down the system a faster and in a better performance.
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Week 9 - PCB Thermal Simulation
JORGE LOZANO Electronic Cooling Simulations using ANSYS ICEPAK PCB THERMAL SIMULATION A PCB board, library files, and traces are imported to create the model. The model is first solved for conduction only, without the components and then solved using the actual components with forced convection. Process Given…
16 Nov 2021 04:05 AM IST
Week 8 - Natural Convection-II
JORGE LOZANO Electronic Cooling Simulations using ANSYS ICEPAK Week 8 - Natural Convection-II Build the model as per the following information. Mesh the model with nonconformal meshing Solve the problem for natural convection. Panel dimensions: height 2000mm, width 800 mm depth: 900mm. Actual current incoming: 1214A.…
15 Nov 2021 06:25 PM IST
Week 7 - Mid-term Project - Natural Convection
JORGE LOZANO Electronic Cooling Simulations using ANSYS ICEPAK Week 7 - Mid-term Project Objective Verify the temperature rise for the low voltage control panel for the following configuration. Build the model as per the following information. Mesh the model with nonconformal meshing Panel dimensions: height 2000mm,…
15 Nov 2021 07:07 AM IST
Week 6.2 - Setting up a model (Hanging Node)
JORGE LOZANO Electronic Cooling Simulations using ANSYS ICEPAK Setting up a model (Hanging Node) A forced convection electronic simulation must be performed, generating postprocessing results from the simulation on a steady state condition. Process First the initial mesh generation must be performed, obtaining…
21 Sep 2021 05:36 AM IST
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