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THEORY: In this project a steady state conjugate heat transfer analysis oon a graphic card has become an everyday used object and a very important part of any computer system, laptops etc. this product is mass produced daily in millions and has made computers exceptionally efficient as they consume electricity to operates…
Arun Reddy
updated on 02 Apr 2022
THEORY:
In this project a steady state conjugate heat transfer analysis oon a graphic card has become an everyday used object and a very important part of any computer system, laptops etc. this product is mass produced daily in millions and has made computers exceptionally efficient as they consume electricity to operates and running a heavy software or graphically task on computer takes a payable use on its graphic card because of which it generates a large amount of heat.
There is a limit to any system that can hold heat to keep its part under safe operating condition.we can not go past these limits as it will damage the system cause failure of the product and system etc. but what we can do is measure to cool this sytem cool the graphic card so the system keeps running at optimum speed and condition.there are various method of cooling electrical components through fan, thermal pastes and gel, double fanning using materials that help dissipating the heat in the fans direction arrangement of components etc
in our simulation conjugate heat transfer analysis is done on graphic card model card model by appling heat on the processor of the graphic card whiule it contained in an encloser. the air is passed at a certain velocity through the encloser and we observe the heat dissipation through the fins by conduction from the procesor then observe how the flowing air cools the fins and observe the heat transfer taking place through it.
GEOMETRY:
3D MODEL:
PART DESCRIPTION:
BASE:
COMPONENT:
FINS:
PROCESSOR:
MESHING:
BASE LINE MESH AT DEFAULT SIZE
REFINED MESH at different location:
BASE: 3mm
PROCESSOR: 0.5mm
COMPONENTS: 0.6mm
FINS: 0.5mm
OUTER ENCLOSER: 3mm
STATISTICS:
NODES=75009
ELEMENTS=425235
SET UP SOLUTION
Solver type: pressure based
Steady state solver
Energy equation is on
Turbulent model : K-Omega SST Model
BOUNDARY CONDITIONS:
Inlet velocity=5 m/s
initial temperature= 300k
CELL ZONE CONDITION:
*Set processor core as source term as heat is generatedby it ingraphic card.
consider,
power supplies to core(p)= 6w
we have,
volume of processsor(v)=64 mm^3
there fore heat generated= p/v = 93750000 w/m^3
NOTE: here in this name of processor is graphic card to clear zone error:
MATERIAL ASSIGNED ARE AS FOLLOWS:
BASE: stell
COMPONENTS: titanium
FINS: aliminium
PROCESSOR: gold
encloser is filled with air.
RESULTS:
BASE LINE MESH 5 m/s (inlet velocity)
RESIDUAL:
FRONT VIEW:
BACK VIEW
TEMPERATURE
HEAT TRANSFER
STRAM LINE
VECTOR LINE
NOW REFINED MESH FOR 1 m/s (velocity)
RESIDUAL:
FRONT VIEW:
BACK VIEW:
TEMPERATURE:
GLOBAL HOTSPOT REGION:
LOCAL HOTSPOT REGION:
TEMPERSTURE AROUND PROCESSOR:
HEAT TRANSFER:
STREAM LINE:
VECTOR LINE:
NOW REFINED MESH FOR 3m/s ( inlet velocity)
RESIDUAL:
FRONT VIEW:
BACK VIEW:
TEMPERATURE:
GLOBAL HOTSPOT REGION:
LOCAL HOTSPOT REGION:
TEMPERATURE AROUND PROCESSOR:
HEAT TRANSFER :
VECTOR LINE:
STREAM LINE:
NOW REFINED MESH FOR 5m/s ( inlet velocity)
RESIDUAL:
FRONT VIEW:
BACK VIEW:
TEMPERATURE:
GLOBAL HOTSPOT REGION:
LOCAL HOTSPOT REGION:
TEMPERATURE AROUND PROCESSOR:
HEAT TRANSFER:
VECTOR LINE:
STREAM LINE:
SR NO. | Inlet velocity (m/s) | Maximum temperature attained |
1 | 1 m/s | 409.4 K |
2 | 3 m/s | 356.3 K |
3 | 5 m/s | 341.9 K |
From this we can conclude that as inlet velocity get increased ....heat generated get decreased.
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