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Vinod A

Having 7 years of Teaching Experience and 4 years of industry experience

Introduction

Presently working as Assistant Professor in the Department of Mechanical Engineering, K. S. School of Engineering and Management, Bengaluru-109.

12 Projects

Week 3 - Geometry simplification of an Electronic enclosure assembly

Objective:

Aim: To import the given power board assembly (CAD body) to Space claim and convert it into ICEPAK body. Introduction: The power board assembly is consists of several components which are soldered onto the PCB. It is crucial to analyse the flow in the assembly. Hence the CAD object is imported to the space claim and simplified…

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20 Nov 2020 02:27 PM IST

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    Week 5.1 - Non-Conformal Meshing and Solving a Cold plate model

    Objective:

    Aim: To Analyse the heat transfer characteristics in the given cold-plated assembly. Introduction:  The model includes two heated plates, cooled by water circulating inside the cold-plate cavity, as well as by air driven by natural convection externally. Separately meshed assemblies will be employed to reduce the overall…

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    01 Feb 2021 12:17 PM IST

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      Week 5.2 - Multi Level Meshing

      Objective:

      Aim: To create a non-conformal meshing for the given Icepak object and comment on the quality of the mesh. Introduction: The given Icepak model is a CAD model consists of three assemblies namely Sheet metal heat sink assembly, DIMM's assembly, and a fan guide assembly. Two grilles are attached on adjacent sides as shown…

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      09 Mar 2021 04:23 AM IST

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        Week 5.3 - Forced convection Analysis

        Objective:

        Aim: To simplify the given CAD object and study the simplified object for forced convection Introduction:  The given electronic assembly consists of a front panel,fan, rear panel with openings, housing. Inside the housing, the assembly consists of PWB (Printed wiring board), coils, BGA package and heat sink, 3 capacitors,…

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        13 May 2021 04:15 PM IST

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          Week 6.1 - Setting up a model (Electronic enclosure)

          Objective:

          Aim: To conduct a steady state analysis for the given electronic enclosure under natural convection Introduction: The assembly contains many components such as resistors, capacitors, heat conductors, heat sink, grilles, power house, USB ports and many more. The power house supplies a heat of 20 W and the working of all…

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          21 Jul 2021 02:13 PM IST

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            Week 6.2 - Setting up a model (Hanging Node)

            Objective:

            Aim:  To analyze the temperature and velocity distributin for the given hanging node assembly.    Introduction: The Hanging node assembly consists of a mother board, BGA packages, CPU, a heat sink, a fan (internal type), DIMM (Dual In-line Memory Module) which consists of 4 heat sources, a guide sweep, 2…

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            01 Aug 2021 08:37 AM IST

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              Week 7 - Mid-term Project - Natural Convection

              Objective:

              Aim: To create a non conformal assembly of the given voltage panel and investigate the temperature rise for natural convection condition. Introduction: Electrical Control Panel: Electrical control panel is a CRCA(cold rolled close annealed) ms sheet enclosure that contains electrical switchgear that controls and monitors…

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              30 Sep 2021 03:02 PM IST

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                Week 8 - Natural Convection-II

                Objective:

                Aim: To create a non conformal assembly of the given voltage panel and investigate the temperature rise for natural convection condition. Introduction: Electrical Control Panel: Electrical control panel is a CRCA(cold rolled close annealed) ms sheet enclosure that contains electrical switchgear that controls and monitors…

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                24 Oct 2021 06:19 AM IST

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                  Week 9 - PCB Thermal Simulation

                  Objective:

                  Aim: To perform an icepak simulation for the given PCB for: i. Conduction only for the Board Outline ii. forced convection analysis for the entire model iii. Joule/trace heating for the given model Procedure: Step 1: Unpack the A11.tzr  Import the ECAD file under the choose type menu and Ansoft Neutral ANF. …

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                  30 Oct 2021 07:34 AM IST

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                    Week 10 - MRF project

                    Objective:

                    Aim: To understand the MRF approach for predicting accurately the flow features in the given CAD object.  Introduction: The Moving Reference Frame (MRF) approach is a steady-state method employed in industrial Computational Fluid Dynamics (CFD) to model problems with rotating parts. It is considered to be less computationally…

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                    09 Nov 2021 01:28 PM IST

                    • CFD
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                    Week 11 - Louver/Grille characterization

                    Objective:

                    Aim: To do a parametric study for the given Hexa Grille for various Reynolds numbers and determine the loss coefficient for the grille.  Introduction to grille A grille is a vent cover through which air is blown into or out of a room for circulation back to the central heating or cooling unit.  Difference…

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                    12 Nov 2021 02:25 PM IST

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                      Week 12 - Final Project - Modelling and Analysis of a Datacenter

                      Objective:

                      Aim: To model the data center and analyze airflow patterns and temperature distribution in the data center  Introduction: A data center is a building, a dedicated space within a building or a group of buildings used to house computer systems and associated components, such as telecommunications and storage systems.…

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                      16 Nov 2021 01:24 PM IST

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                        Showing 1 of 12 projects

                        1 Course Certificates

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                        Electronic Cooling Simulations using ANSYS ICEPAK

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                        3 Workshop Certificates

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                        Turbulence and CFD

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                        Linear Algebra & its Importance in Engineering, Technology & Culture

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                        Introduction to applied strength of materials

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                        Academic Qualification

                        M.Tech

                        University BDT College of Engineering

                        22 Oct 2012 - 10 Sep 2014

                        B.E

                        Bhagwan Mahavir Jain College of Engineering

                        15 Sep 2007 - 10 Jun 2010

                        Diploma

                        Governement Polytechnic Chintamani

                        01 Aug 2004 - 09 Jun 2007

                        10th

                        Mahila Samaja High School

                        10 Jun 2003 - 11 May 2004

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