Week 5.2 - Multi Level Meshing

Aim: To model the data center and analyze airflow patterns and temperature distribution in the data center  Introduction: A data center is a building, a dedicated space within a building or a group of buildings used to house computer systems and associated components, such as telecommunications and storage systems.…

Aim: To do a parametric study for the given Hexa Grille for various Reynolds numbers and determine the loss coefficient for the grille.  Introduction to grille A grille is a vent cover through which air is blown into or out of a room for circulation back to the central heating or cooling unit.  Difference…

Aim: To understand the MRF approach for predicting accurately the flow features in the given CAD object.  Introduction: The Moving Reference Frame (MRF) approach is a steady-state method employed in industrial Computational Fluid Dynamics (CFD) to model problems with rotating parts. It is considered to be less computationally…

Aim: To perform an icepak simulation for the given PCB for: i. Conduction only for the Board Outline ii. forced convection analysis for the entire model iii. Joule/trace heating for the given model Procedure: Step 1: Unpack the A11.tzr  Import the ECAD file under the choose type menu and Ansoft Neutral ANF. …

Aim: To create a non conformal assembly of the given voltage panel and investigate the temperature rise for natural convection condition. Introduction: Electrical Control Panel: Electrical control panel is a CRCA(cold rolled close annealed) ms sheet enclosure that contains electrical switchgear that controls and monitors…

Aim: To create a non conformal assembly of the given voltage panel and investigate the temperature rise for natural convection condition. Introduction: Electrical Control Panel: Electrical control panel is a CRCA(cold rolled close annealed) ms sheet enclosure that contains electrical switchgear that controls and monitors…

Aim:  To analyze the temperature and velocity distributin for the given hanging node assembly.    Introduction: The Hanging node assembly consists of a mother board, BGA packages, CPU, a heat sink, a fan (internal type), DIMM (Dual In-line Memory Module) which consists of 4 heat sources, a guide sweep, 2…

Aim: To conduct a steady state analysis for the given electronic enclosure under natural convection Introduction: The assembly contains many components such as resistors, capacitors, heat conductors, heat sink, grilles, power house, USB ports and many more. The power house supplies a heat of 20 W and the working of all…

Aim: To simplify the given CAD object and study the simplified object for forced convection Introduction:  The given electronic assembly consists of a front panel,fan, rear panel with openings, housing. Inside the housing, the assembly consists of PWB (Printed wiring board), coils, BGA package and heat sink, 3 capacitors,…

Aim: To create a non-conformal meshing for the given Icepak object and comment on the quality of the mesh. Introduction: The given Icepak model is a CAD model consists of three assemblies namely Sheet metal heat sink assembly, DIMM's assembly, and a fan guide assembly. Two grilles are attached on adjacent sides as shown…

Aim: To Analyse the heat transfer characteristics in the given cold-plated assembly. Introduction:  The model includes two heated plates, cooled by water circulating inside the cold-plate cavity, as well as by air driven by natural convection externally. Separately meshed assemblies will be employed to reduce the overall…

Aim: To import the given power board assembly (CAD body) to Space claim and convert it into ICEPAK body. Introduction: The power board assembly is consists of several components which are soldered onto the PCB. It is crucial to analyse the flow in the assembly. Hence the CAD object is imported to the space claim and simplified…