Week 11 - Louver/Grille characterization

Problem 1: Conduction heat transfer modeling of PCB. PCB board along with mounted componens is imported in Icepak using File > Import > IDF file > New. Select A1.bdf file that contains the details of PCB board dimensions, components etc using Browse button of Board file.   Select detailed type in import and…

AIM : To set up sover settings for simulation.   Steps to carry out simulation: 1. Geometry modeling,                                             2. Mesh generation,            …

AIM : Apply MRF model for fan CAD model.   Why to use MRF model for fan? Fan can be incorporated in the simulation using either fan objects available in Icepak or using CAD geometry of fan. When fan object is used in the model, it is not able to capture tangential and radial components of velocity and swirl as it…

AIM: Simulate cooling of Low Voltage Panel using natural convection heat transfer.   Introduction: Low voltage panels are used to distribute power from main power source to different branches. Main components of a typical electrical panel are listed below: - Housing / Enclosure : It houses all the components…

AIM: Simulate cooling of Low Voltage Panel using natural convection heat transfer.   Introduction: Low voltage panels are used to distribute power from main power source to different branches. Main components of a typical electrical panel are listed below: - Housing / Enclosure : It houses all the components of the…

AIM : To set up simulation problem for forced convection cooling.   In order to maintain the temperature of the electronics components in the electronics enclosure under the maximum specified temperature, fans are used where the generation of heat is relatively high. The electronics model consists of CPU source…

AIM: To create multi-level meshing for CAD objects in the model.   In this challange optimal mesh is generated using two common technique called 'seperate mesh generation' and 'multi-level mesh'. Seperate mesh generation is used to reduce mesh bleeding from the assembly to the fluid domain. It reduces the mesh count…

AIM: To carry out the complete simulation for given geometry using ANSYS Icepak.   Simulation is carried out for the electronics enclosure given in the challange. A 2D fan is used to create a flow of air over the electronics packages that generates the heat. To efficiently maintain flow of air within the enclosure,…

Introduction to Datacenter Cooling Datacenter produces large amount of heat and this gives rise to the temperature of the datacenter components. As the datacenter contains the major portion of electronic components, the performance of the electronics components and hence datacenter significantly gets impacted by operating…

Aim: To characterize grill of electronic enclosure for different Reynolds number.   Grills are an important feature of any electronics enclosure be it natural convection cooling or forced convection. While designing the enclosure for electronics cooling, thermal engineer is always concerned about tradoff between thermal…

AIM: To simulate thermal performance of cold plate.   Cold plate is used for maintaining temperature of electronics components below the maximum operating temperature by removing heat. Modern cold plate uses liquids as medium to carry away generated heat.   Create Geometry Step 1: Resize cabinet with dimensions:…

Aim: To convert electonic assembly into Icepak object using spaceclaim.   To analyze any electronic assembly thermally using Icepak, it is first converted into Icepak compatible object. To convert assembly into Icepak object, it is simplified using four levels of Icepak Simplify feature. Also, unnecessary components…