Week 6 - CHT Analysis on a Graphics card
Aim : To check the conjugate heat for the graph card at different velocities.
Introduction : heat coefficient for the hot body is to be known to maintain the limit for melting and conductivity properties . It help in design the components for computer as we know electronic component release the heat due to the electron movement. We can increase the efficiency for the electronic component by cooling them timely. Help in selection of coolant for the components.
Eg: processor ,radiator in car ,heat exchanger in power plants etc.
Solving & Modelling approach:
Imported the geometry in the space clam .
Apply the shared tropology from workbench to the components.
Pre-processing and solver setting.

Allocated the names to the enclosure & graphic card components.

Course mesh generated.

Created the section plane.
Setup.

physical condition : selecting the energy equation & k epsilon for the heat transfer coefficient to the processor . because the low velocity ,no density changes near the processor.

Created the new material for solid components .

Wood -for base plate
Silicon- processor
Aluminium – for the fin plate.
Air – fluid enclosure .

Inputs value are given to the source term as the 15625000 value for the processor.
Case-1

Velocity -1 m/s for course mesh.
Residuals
Velocity
Temperature

Heat flux



Hot pot for the graphic card.

Refined mesh generated .
Case-2

Velocity -5m/s
Residuals

Velocity

Temperature.

Heat flux



Hot spot for the graphical card
Case-3

Velocity -10m/s

Residual

velocity

Temperature

Heat flux.



Hot spot for grapical card
Table - conjugate heat transfer for the different velocities.
|
Mesh |
Velocity |
Temperature - k |
Heat flux-w/m2k |
|
Course |
1m/s |
314.1 |
1.07 |
|
Refined |
5 m/s |
305 |
10.98 |
|
Refined |
10m/s |
303 |
15.056 |
Conclusion-
1.Refined the mesh will get the accurate results compared to the course mesh.
2.As we see the velocity increase the temperature decrease the for the process .It shows the velocity increase it will get the better cooling to maintain the better efficiency for the component.