Week 6 - CHT Analysis on a Graphics card
Aim:- Perform a steady-state conjugate heat transfer analysis on a model of a graphics card.
Objectives:
- Run the simulation by varying the velocity from 1m/sec to 5m/sec for at least 3 velocities and discuss the results.
- Find out the maximum temperature and heat transfer coefficient attained by the processor.
- Prove that the simulation has achieved convergence with appropriate images and plots.
- Identify potential hotspots on the model.
Theory:-
Conjugate Heat transfer analysis:- A CHT (Conjugate Heat Transfer) analysis is useful where there are multiple modes of heat transfer in our computational domain, like conduction and convection. Having such a great number of applications for this type of simulation makes it important to be studied in depth.
The Conjugate Heat Transfer (CHT) analysis type allows for the simulation of heat transfer between solid and fluid domains by exchanging thermal energy at the interfaces between them. Typical applications of this analysis type exist as, but are not limited to, the simulation of heat exchangers, cooling of electronic equipment, and general-purpose cooling and heating systems.
we need to enable energy equationand provide the appropiate boundary condition to understand it properly.
Some applications are
- Temperature distribution analysis.
- Heat flux rate analysis – calculation of wall heat flux rates or heat transfer coefficients.
- Visualisation of heat transfer features for improved understanding of system flow phenomena.
- Identification of localised ‘hot spots’ or heat sinks in checking against specified requirements.
- Evaluating variation in temperature peaks for different operating conditions/ failure modes.
- Assessing insulation or heat shield effectiveness and optimising of material selections.
- Coupling CHT with FE analysis to evaluate thermally induced stresses, expansion or fatigue.
- Temperature field analysis
- CFD thermal analysis
- Heat transfer coefficient analysis
- Heat transfer rate analysis
Fundamentals related with heat transfer.
Mode of heat transfer are
1. conuction
2. convection
3. radiation

Conduction:- In conduction mode of het transfer the transfer is take place between adjacent molecules, bulk motion is not needed for heat transfer.
this can be calculated using fourier law.
for a plane layer, heat conduction layer for a plane layer is directly proportional to temprature difference and area across the layer but inversely proportional to the layer thickness
this can be governed by
Qc = -k A dt/dx
k is the thermal conductivity( unit Watt/m.k, it is a material property)
A is the area
dt is the temprature difference between the plane
dx is the thickness
Convection:- In convection mode of het transfer the transfer due to fluid flow, bulk motion is needed for heat transfer.
this can be calculated using newtons law.
heat convection directly proportional to temprature difference and area across
Qc = h A dt
h is the convective heat transfer( unit Watt/m^2.k)
A is the normal surface area
dt is the temprature difference between the plane
Radiation: Stefan Boltzman law of radiation
it state that radiation energy emitted from the surface of a black body is directly proportional to the 4th power of absolute temprature
Qr = sigma*T^4
sigma is stefan boltzman constant 5.67*10^-8 Watt/m^2k
Thermal diffusivity: is the ability of the material by which heat can propogate within the material
it is the ratio of thermal conductivity/Rho*c
here rho is the density (kg/m^3)
c is the specific heat (J/kg K)
Nusselt Number: Nusselt no is the ration of convective heat transfer to the conductive heat transfer
convective heat transfer/conductive heat transfer
hl/k
CFD:-Computational fluid dynamics or CFD is the analysis of systems involving fluid flow, heat transfer and associated phenomena such as chemical reactions by means of computer-based simulation.
Practical application in current scenario
- aerodynamics of aircraft and vehicles: lift and drag
• hydrodynamics of ships
• power plant: combustion in internal combustion engines and gas
turbines
• turbomachinery: flows inside rotating passages, diffusers etc.
• electrical and electronic engineering: cooling of equipment including
microcircuits
• chemical process engineering: mixing and separation, polymer moulding
• external and internal environment of buildings: wind loading and
heating/ventilation
• marine engineering: loads on off-shore structures
• environmental engineering: distribution of pollutants and effluents
• hydrology and oceanography: flows in rivers, estuaries, oceans
• meteorology: weather prediction
• biomedical engineering: blood flows through arteries and veins
CFD Work Flow:- CFD codes are structured around the numerical algorithms that can tackle fluid flow problems. In order to provide easy access to their solving power all commercial CFD packages include sophisticated user interfaces to input problem parameters and to examine the results
Its threee step process
(i) a pre-processor
involves defination of geometry, grid generation, selection of phenomenon that need to model
(ii) a solver
intergration of governing equation, discretisation and solution
(iii) a post-processor
ploting of contour, graphs and making movies.
In solving fluid flow problems we need to be aware that the underlyingphysics is complex and the results generated by a CFD code are at best asgood as the physics (and chemistry) embedded in it and at worst as good asits operator with CFD
Solving and Modeling Approch:-
There are no way present to understand and analyse the effeciveness of the mixiing tee model.
1. analytical approch
2. simulation approch
3. experimental approch
using analytical approch and experimental approch is time consuming and high cost senario. this could be eliminated by using simulation approch in which we can analyse the system with the actual codition we are intrested in.
To do this we are using ansys fluent solver
we are using fluid flow analysis using Fluent solver because we are interested in the total effectiveness of the fluid in the mechnical tee model, here we are using two different models to analyse the effectiveness of the mixing of fluid.
Approch we are using.
1. We need to open Ansys workbench
2. Choose the Appropiate Solver
3. Assign Appropiate name
4. Choose geometry and select new spaceclaim model.
5. Load the appropiate file
6. Implement the geometrical operation
7. Apply the mesh and provide name selection
8. Choose setup, select the appropiate model
9. Initalisation and running the simulation
10. Result making i.e. countour plots graphs
1. Opening Ansys workbench

2. Choose the Appropiate Solver

3. Assign Appropiate name
4. Opening of space claim geometry do to geometrical operation

now go to workbench and use share topology


Now we can move to mesh mode
Meshing
| Component Name | Fine mesh | Coarse mesh |
| Processor | .5 mm | 1 mm |
| Fins | 1.5 mm | 2.5 mm |
| PCB | .5 mm | 1 mm |
| Enclosure | 8 mm | 10 mm |
Case
Case 1. Fine mesh with U = 3m/s
Case 2. Coarse mesh with U = 3m/s
Case 3. Fine mesh with U = 1m/s
Case 4. Coarse mesh with U = 1m/s
Case 5. Fine mesh with U = 5m/s
Case 6. Coarse mesh with U = 5m/s
Now provide the name selection



now we done with meshing part move to setup mode
Setup:-
Settings
| Solver | Steady state |
| Energy Equation | ON |
| Model | Laminar |
| Inlet | Inlet Velocity |
| Outlet | Pressure Outlet |
| Material_(Fluid) | Air, 3 user defined |
| Cell Zone Condition | Air, 3user defined |
Material Property that used for this particular simulation
| Material Name | Density(kg/m^3) | Cp(J/kgK) | Thermal Conductivity (W/m.K) |
| Alluminium | 2719 | 871 | 202.4 |
| Silicon | 2330 | 703 | 153 |
| Pcb | 55 | 1210 | .027 |
GO to cell zone and provide the materials to the different components

select the component and choose the appropiate material.

in similar manner we assign the materials to remaining components.
No Create the required reports and countour we are looking for
Results
1. Residuals
for Fine mesh
|
Fine mesh with U = 5m/s |
Fine mesh with U = 3m/s |
Fine mesh with U = 1m/s |
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for Coarse mesh
|
Coarse mesh with U = 5m/s |
Coarse mesh with U = 3m/s |
Coarse mesh with U = 1m/s |
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2.Temprature at Processor
for Fine mesh
|
Fine mesh with U = 5m/s |
Fine mesh with U = 3m/s |
Fine mesh with U = 1m/s |
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for Coarse mesh
|
Coarse mesh with U = 5m/s |
Coarse mesh with U = 3m/s |
Coarse mesh with U = 1m/s |
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3.HTC
for Fine mesh
|
Fine mesh with U = 5m/s |
Fine mesh with U = 3m/s |
Fine mesh with U = 1m/s |
|
|
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for Coarse mesh
|
Coarse mesh with U = 5m/s |
Coarse mesh with U = 3m/s |
Coarse mesh with U = 1m/s |
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4.Temprature Contour
for Fine mesh
|
Fine mesh with U = 5m/s |
Fine mesh with U = 3m/s |
Fine mesh with U = 1m/s |
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for Coarse mesh
|
Coarse mesh with U = 5m/s |
Coarse mesh with U = 3m/s |
Coarse mesh with U = 1m/s |
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5.Velocity Contour
for Fine mesh
|
Fine mesh with U = 5m/s |
Fine mesh with U = 3m/s |
Fine mesh with U = 1m/s |
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for Coarse mesh
|
Coarse mesh with U = 5m/s |
Coarse mesh with U = 3m/s |
Coarse mesh with U = 1m/s |
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6.Hot zones
for Fine mesh
|
Fine mesh with U = 5m/s |
Fine mesh with U = 3m/s |
Fine mesh with U = 1m/s |
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for Coarse mesh
|
Coarse mesh with U = 5m/s |
Coarse mesh with U = 3m/s |
Coarse mesh with U = 1m/s |
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7.Velocity Vector
for Fine mesh
|
Fine mesh with U = 5m/s |
Fine mesh with U = 3m/s |
Fine mesh with U = 1m/s |
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for Coarse mesh
|
Coarse mesh with U = 5m/s |
Coarse mesh with U = 3m/s |
Coarse mesh with U = 1m/s |
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8.Animation
for Fine mesh
|
Fine mesh with U = 5m/s |
Fine mesh with U = 3m/s |
Fine mesh with U = 1m/s |
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for Coarse mesh
|
Coarse mesh with U = 5m/s |
Coarse mesh with U = 3m/s |
Coarse mesh with U = 1m/s |
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9.HTC and Temprature attend by the processsor
for Fine mesh
|
Fine mesh with U = 5m/s |
Fine mesh with U = 3m/s |
Fine mesh with U = 1m/s |
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for Coarse mesh
|
Coarse mesh with U = 5m/s |
Coarse mesh with U = 3m/s |
Coarse mesh with U = 1m/s |
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Inference
1. Temprature on the surface of pressor increases as the velocity of air decreases as we can see in when velocity is 5m/s average temprature at processer is about 322.68k and when we use velocity of air as 1m/s the temprature rise to 363.86k
2. The main hot points are preocessor and area which in direct contact with processor i.e. fin parts and pcb
3. When we are using coarse mesh we are not accurate results
4. Heat transfer coefficient maximum at velocity 1m/s
5. Main Heat producing source is processor
6. Velocity is zero when it comes in direct contact with the main component
7. Temprature is lower on right side as air coming from right to left direction





















































