Challenge

Week 9 - PCB Thermal Simulation

Aim

A PCB board, library files, and traces are imported to create the model. The model is first solved for conduction only, and then solved using the actual components with forced convection.

Introduction

In the current project, the following tasks are performed:

  1. Create a new project
  2. Import board layout from trace folder using .trz file
  3. Import ECAD file (*.anf) A1.anf can be found in the folder containing the input files from downloaded trace folder
  4. Once the import process is completed, change the layer thickness using edit oprion on PCB board component.

For more details please have a look at attached report

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