Week 6 2 Solution

assignment 2 of week 5 Meshed Model is considerd for this Simulation.

Explaination:

Materials and power dissipations had been defined already in the given model.

Material Details:

POWER DISSIPATION DETAILS

BGA-134.2 -12 Watts
BGA-235.2 - 6 Watts
QFP-130-mold - 7 Watts
QFP-231.2 - 1.5 Watts
QFP-332.2 - 1.5 Watts
QFP-433.2 - 1.5 Watts
SOIC-111.2 - 0.3 Watts
SOIC-112.2 - 0.3 Watts
SOIC-113.2 - 0.3 Watts
SOIC-214.2 - 0.3 Watts
SOIC-316.2 - 0.3 Watts
SOIC-415.2 - 0.3 Watts
TO252-128.2- 0.2 Watts
TO252-129.2- 0.2 Watts
TO252-219.2- 0.2 Watts
TO252-220.2- 0.2 Watts
TO252-221.2- 0.2 Watts
CPU Source - 40 Watts
DIMM_Source-0 - 2 Watts
DIMM_Source-1 - 2 Watts
DIMM_Source-2 - 2 Watts
DIMM_Source-3 - 2 Watts
DIMM_Source-4 - 2 Watts
DIMM_Source-5 - 2 Watts
DIMM_Source-6 - 2 Watts
DIMM_Source-7 - 2 Watts

Total Power Dissipation considered for this Analysis is 88.3 Watts.

05. Radiation is turned off. Cabinet is set as Opening in the area where the grill is defined

06. Gravity is turned on.Atmospheric pressure and tempertaure is kept as default

07.Solution Iteration is set to 300. Reset the values generated automatic Reynolds and peclet Number which recommand the turbulent flow for this problem.

08. Pressure and momentum relaxation parameters are maintained 0.3 and 0.7 respectively.

09. Zero equation turbulant model is maintained.

Solution

Solution is converged after 250 iteration and stopped automatically.

Temperature.

RESULT AND CONCLUSION

DIMM_Source-0 165.504 C
DIMM_Source-1 160.162 C
DIMM_Source-2 168.465 C
DIMM_Source-3 165.856 C
DIMM_Source-4 165.553 C
DIMM_Source-5 161.762 C
DIMM_Source-6 156.645 C
DIMM_Source-7 140.153 C
CPU_source 93.3232 C
20_PIN_SOCKET10.2 43.4829 C
34_PIN_BOX9.2 47.4198 C
40_PIN_BOX7.2 58.0165 C
40_PIN_BOX8.2 60.9744 C
BGA-134.2 105.775 C
BGA-235.2 104.213 C
BI_SERIAL_PORT5.2 41.8099 C
KB43.2 48.1336 C
Motherboard 107.894 C
PARALLEL_PORT6.2 52.0905 C
QFP-231.2 76.1804 C
QFP-332.2 91.8235 C
QFP-433.2 68.3149 C
SOIC-111.2 73.8027 C
SOIC-112.2 72.0682 C
SOIC-113.2 76.6739 C
SOIC-316.2 76.8848 C
SOIC-415.2 76.7701 C
TO252-128.2 49.3462 C
TO252-129.2 51.7966 C
DIMM_PCB-0_1.1 168.465 C
DIMM_SOCKET_A-0 63.2602 C
DIMM_SOCKET_A-1 105.549 C
DIMM_SOCKET_A-2 105.739 C
DIMM_SOCKET_A-3 89.6732 C
DIMM_SOCKET_A-4 151.354 C
DIMM_SOCKET_A-5 150.958 C
DIMM_SOCKET_A-6 160.763 C
DIMM_SOCKET_B-0 37.3921 C
DIMM_SOCKET_B-1 39.6793 C
DIMM_SOCKET_B-2 46.1313 C
DIMM_SOCKET_B-3 49.9379 C
DIMM_SOCKET_B-4 59.4266 C
DIMM_SOCKET_B-5 58.0286 C
DIMM_SOCKET_B-6 66.1086 C
SOIC-214.2 47.6281 C
TO252-219.2 50.3686 C
TO252-220.2 51.7368 C
TO252-221.2 51.7368 C
CPU_Mold 93.3232 C
CPU_Substrate 93.3232 C
CPU_socket-0 50.5519 C
CPU_socket-1 58.0948 C
CPU_socket-2 53.2387 C
CPU_socket_fluid-0 55.3444 C
CPU_socket_fluid-1 67.3173 C
CPU_solderballs 67.3175 C
HS_base-0 91.3946 C
HS_fin-0 58.5511 C
HS_fin-1 60.2338 C
HS_fin-10 59.6953 C
HS_fin-11 60.7199 C
HS_fin-12 60.0617 C
HS_fin-13 60.4978 C
HS_fin-14 60.8952 C
HS_fin-15 61.0283 C
HS_fin-16 60.8315 C
HS_fin-17 60.3701 C
HS_fin-18 59.7431 C
HS_fin-19 58.8706 C
HS_fin-2 58.1033 C
HS_fin-20 58.4595 C
HS_fin-21 58.0976 C
HS_fin-22 61.1429 C
HS_fin-23 58.2634 C
HS_fin-24 58.4227 C
HS_fin-25 58.6229 C
HS_fin-26 58.493 C
HS_fin-27 58.3442 C
HS_fin-28 59.0984 C
HS_fin-29 59.7906 C
HS_fin-3 58.4761 C
HS_fin-30 61.6458 C
HS_fin-31 63.281 C
HS_fin-32 64.8183 C
HS_fin-33 61.2836 C
HS_fin-34 65.4679 C
HS_fin-35 64.4024 C
HS_fin-36 62.8489 C
HS_fin-37 61.4035 C
HS_fin-38 59.173 C
HS_fin-39 59.8808 C
HS_fin-4 60.6904 C
HS_fin-40 61.8257 C
HS_fin-41 63.5824 C
HS_fin-42 65.3567 C
HS_fin-43 66.1608 C
HS_fin-44 61.0645 C
HS_fin-45 64.8237 C
HS_fin-46 63.1014 C
HS_fin-47 61.5559 C
HS_fin-48 58.9947 C
HS_fin-49 59.6571 C
HS_fin-5 60.814 C
HS_fin-50 61.341 C
HS_fin-51 62.7648 C
HS_fin-52 63.9806 C
HS_fin-53 64.4337 C
HS_fin-54 63.6928 C
HS_fin-55 60.541 C
HS_fin-56 62.4751 C
HS_fin-57 61.2101 C
HS_fin-58 58.8919 C
HS_fin-59 59.5142 C
HS_fin-6 60.5811 C
HS_fin-60 61.0446 C
HS_fin-61 62.3477 C
HS_fin-62 63.3761 C
HS_fin-63 63.7168 C
HS_fin-64 63.145 C
HS_fin-65 62.0876 C
HS_fin-66 59.8573 C
HS_fin-67 60.9902 C
HS_fin-68 58.7308 C
HS_fin-69 59.2912 C
HS_fin-7 60.4244 C
HS_fin-70 60.6324 C
HS_fin-71 61.6886 C
HS_fin-72 62.5254 C
HS_fin-73 62.8159 C
HS_fin-74 62.4275 C
HS_fin-75 61.6322 C
HS_fin-76 60.7311 C
HS_fin-77 58.9174 C
HS_fin-78 58.6259 C
HS_fin-79 59.1401 C
HS_fin-8 60.2746 C
HS_fin-80 60.3172 C
HS_fin-81 61.2348 C
HS_fin-82 61.9392 C
HS_fin-83 62.1784 C
HS_fin-84 61.8655 C
HS_fin-85 61.1886 C
HS_fin-86 60.4474 C
HS_fin-87 59.8618 C
HS_fin-9 60.0422 C
QFP-130-Leads 108.699 C
QFP-130-mold 109.209 C

01. DIMM Sources are experiencing higher temperature of Max 168 degree C. This value has to be checked with the Allowable Junction temperature of DIMM Component to decide if this component is safe or not.

02. BGA 134 and 235 have the temperature of more than 105 C. Since mostly the BGA will have the allowable junction temperature upto 150 C. There is sufficient safety margin is available here. Hence it is safe.

03. QFP 130 has the value of 109 degree C. data sheet should be checked to know the component failture.

04. Air velocity at fan inlet is around 5.2 m/s which is high. pressure build up has to be verified in this region.

05. Air flow is sreamed well and enough (since it has higher velocity which lead higher convective heat transfer co efficient) to take the heat generated within the system.