Assignment 6 1 for Week 6

assignment 1 of week 3 Model is considerd for this Simulation.

Explaination:

01.Model is imported into Icepak environment and grouped the components without changing the physics.

02. Non conformal assembly is created and Meshed using the options a, Multilevel meshing

b.Mesh assembly Seperately, c. Uniform mesh parameters.

03.After meshing, mesh quality is evaluated by taking cut plane and Mesh Volumes. Mesh Quality also checked with Skeiwness,Face alignment and found Values are within the acceptable range

04. Materials and power dissipations are defined randmly. Mostly electronic components are defined as Ceramic material where as the heat sink and Enclosure are defined with Aluminium material.

POWER DISSIPATION DETAILS

PCB 4 W
Heatsink_component.1 1 W
Heatsink_component.2 1 W
component 0.5 W
component.2 0.5 W
component.3 0.5 W
component.5 0.5 W
component.6 0.5 W
component.7 0.05 W
component.8 0.5 W
component.9 0.5 W
component.10 0.5 W
component.11 2 W
Component 0.05 W
component.1 0.5 W
component.4 0.05 W

Total Power Dissipation considered for this Analysis is 12.65 Watts.

05. Radiation is turned off. Cabinet is set as Opening for all the direction

06. Gravity is turned on.Atmospheric pressure and tempertaure is kept as default

07.Solution Iteration is set to 100. Reset the values generated

08. Pressure and momentum relaxation parameters are maintained 0.3 and 0.7 respectively.

09. Zero equation turbulant model is maintained.

Solution

Solution is converged after 50 iteration and stopped automatically.

Temperature

Velocity

Result and Conclusion

BACK PLATE 134.734 C
FRONT PLATE 126.838 C
PCB 231.867 C
RHS PLATE 133.572 C
STANDOFF 125.883 C
STANDOFF.1 130.915 C
STANDOFF.1.1 133.131 C
STANDOFF.2 125.867 C
TOP_COVER 134.787 C
BOTTOM PLATE 133.134 C
LHS PLATE 131.4 C
BACK.1 124.517 C
Left_box 124.423 C
Right_box 124.383 C
Top 124.14 C
Heatsink_component.1 172.244 C
Heatsink_component.2 173.338 C
component 205.238 C
component.2 209.139 C
component.3 206.642 C
component.5 216.515 C
component.6 193.594 C
component.7 211.375 C
component.8 192.698 C
component.9 228.579 C
component.10 223.367 C
component.11 231.085 C

Highest tempearture is observed in the Electronic Component with 231.085 C , This is because of high heat flux means the componet siye is small at the same time this component is dissipating 2 Watts. Hence under given circumstance this component would fail.Because the component junction temperature will even more.

Proposal

01. Providing Cu Vias for those compoenents have high temperature.

02. Heatsink arrangement

03.heat pipe solution

If the Radiation effect is considered, the temeparture would fall.