Enclosure Meshing Optimization

Explaination

-CAD Model is downloaded into space claim.

-CAD models are converted into ICEPACK bodies.

-For Initial study Front plate and Fan are directly imported as CAD object.

-All other parts are converted into level 1 bodies

-ICEPACK bodies are imported into Icepak environment

-Separate assembly is created

-Components (T0220) are created as separateassembly. Die is defined as heatsource.

-Capacitors are grouped as separate assembly with slack values

-Transformer coils are grouped as separate assembly

-Since LHS and RHS heatsinks are sliced as cuboid bodies, they are grouped as separate assembly.Front,rear plate is adjusted accordngly to avoide assembly boundary box collision

-BGA assembly along with heat sink is grouped as sepearte assembly

-Components leads are adjusted to avoide collision into the PCB

-For intial Meshing is carried out without any changes. But meshing was very poor for CAD objects (front panel and fan)

-Then multi level meshing is applied to CAD objects (level 2). Still mesh optimiyation is not satisfactory.

-So with out compromising the physics, CAD front panel is replaced with Icepack block and fan opening is modeled as hollow block with area multiplier.

-CAD model of fan is replaced by 3D fan using fan option.

-Automatic case tool is checked and found all the requirements are met without any error.

-Meshing is carried out and mesh qualities are checked and found ok.

-Meshing is optimized with this configuration. (Non conformal meshing /multi level meshing techniques).

CONCLUSION

-Given CAD model is converted into ICEPAK bodies.

-Non Conformal assembly is created

-Mesh resolution is achieved using multi level and non conformal meshing techniques

-Mesh resolution is checked by taking cut planes

-Meshing qualities- Face alignement and Skewness are within the recommended limit