Week 6 - CHT Analysis on a Graphics card
l. OBJECTIVE
- To perform steady-state conjugate heat transfer analysis on Graphics Card
- To find the effect of different velocities on the temperature
ll. INTRODUCTION
1. Conjugate Heat Transfer (CHT):
Conjugate heat transfer is defined as the heat transfer between two domains by exchange of thermal energy. For a system the thermal energy available is defined by its temperature and the movement of thermal energy is defined by its heat flux through the outer walls. Heat transfer in solid happens through conduction and walls by convection and in liquid phase through convection.
CHT provides the temperature prediction and the hotspot regions at the solid-fluid interface and we can also predict the heat transfer accurately for example- Conduction through solids, convection through fluid, and thermal radiation. It also provides the velocity and pressure distribution of fluid moving inside the solid. We can also use CHT in design optimization for improvement for heat transfer and cooling capacity.
2. Graphic Card:
A video card (also called a graphics card, display card, graphics adapter, or display adapter) is an expansion card that generates a feed of output images to a display device (such as a computer monitor). Most video cards are not limited to a 6-inch simple output. Their integrated graphics processor can perform additional processing, removing this task from the central processor of the computer.

lll. PROBLEM STATEMENT
- Simulate CHT analysis on a model of a graphics card and use appropriate materials of your choice for the simulation.
- Simulate by varying the velocity from 1m/sec to 5m/sec for at least 3 velocities.
- Find out the max temperature and heat transfer coefficient attained by the processor.
IV. SIMULATIONS AND PROCESS:
PART 1:
The geometries in both parts of the project are the same.
CASE 1:
GEOMETRY:
Using the given geometry, have to share the topology to reduce the interferences with:
1. Processor

2. Fins

3. Base

4. Encloser

5. Graphic card

MESH:
We start the mesh by naming the parts
1. Inlet
2. outlet
3. Wall symmetry
4. components
5. Fins
6. Base
7. Processor
Then we give a total element size of 0.003 m and applying a body sizing to the processor with an element size of 0.0015. Making this our Refined mesh.


SIMULATIONS
|
SETUP |
||
|
Solver Type |
Pressure-Based |
|
|
Velocity Formulation |
Absolute |
|
|
Time |
|
|
|
Models |
Viscous model: K-omega SST Energy model: On |
|
|
Material |
Fluid type: Air Solid-type: Aluminium : gold : copper |
|
|
Cell zones |
Fluid type: Air Solid: Al, Au, Cu |
|
|
Boundaries |
Inlet : inlet velocity: 2m/s : temperature = 300K Outlet: outlet pressure = 0 |
|
|
Reference values |
Standard |
|
|
Initialization |
Standard |
Usually, the power consumed by a processor is converted into heat energy. To calculate the heat generated on the processor which is = Power consumed divided by the total volume of the processor
"The power consumption of today's graphics cards has increased a lot. The top models demand between 110 and 270 watts from the power supply; in fact, a powerful graphics card under full load requires as much power as the rest of the components of a PC system combined"
Taking this fact we will assume the power consumed to be 55 (being half of the upgraded graphic card)
Heat generated = `55 / (64 ⋅ (10)^ (− 9)] W /m^ 3 = 859375000 W /m ^3`
V. RESULTS:
Residual plots

The temperature on the Graphic card

Wall heat transfer coefficient

Post Processing:
Temperature contour 
Velocity contour

Temperature on processor

the temperature on the processor (local)

Temperature of fins

Temperature of Base

CASE 2:
SIMULATIONS
|
SETUP |
||
|
Solver Type |
Pressure-Based |
|
|
Velocity Formulation |
Absolute |
|
|
Time |
|
|
|
Models |
Viscous model: K-omega SST Energy model: On |
|
|
Material |
Fluid type: Air Solid-type: Aluminium : gold : copper |
|
|
Cell zones |
Fluid type: Air Solid: Al, Au, Cu |
|
|
Boundaries |
Inlet : inlet velocity: 5m/s : temperature = 300K Outlet: outlet pressure = 0 |
|
|
Reference values |
Standard |
|
|
Initialization |
Hybrid |
RESULTS:
Residual plots

The temperature on the Graphic card

Wall heat transfer coefficient

Post Processing:
Temperature contour 
Velocity contour

Temperature on processor

the temperature on the processor (local)

Temperature of fins

Temperature of Base

Show in case 3 and part 2 differences below :
PART 2:
First, we'll show the mesh of part 2 which is our baseline mesh
MESH
Then we give a total element size of 0.005 m and applying a body sizing to the processor with an element size of 0.0025
and applying sizing for the components with curvature on. Making this our base mesh.


CASE 3 And PART 2:
SIMULATIONS
|
SETUP |
||
|
Solver Type |
Pressure-Based |
|
|
Velocity Formulation |
Absolute |
|
|
Time |
|
|
|
Models |
Viscous model: K-omega SST Energy model: On |
|
|
Material |
Fluid type: Air Solid-type: Aluminium : gold : copper |
|
|
Cell zones |
Fluid type: Air Solid: Al, Au, Cu |
|
|
Boundaries |
Inlet : inlet velocity: 5m/s : temperature = 300K Outlet: outlet pressure = 0 |
|
|
Reference values |
Standard |
|
|
Initialization |
Hybrid |
RESULTS:
| DIFFERENCE (with inlet velocity = 1m/s) | CASE 3(REFINED MESH) | PART 2(BASELINE MESH) |
| Residual plots | ![]() |
![]() |
| The temperature on the Graphic card | ![]() |
![]() |
| Wall heat transfer coefficient | ![]() |
![]() |
| Post Processing: | ||
| Temperature contour | ![]() |
![]() |
| Velocity contour | ![]() |
![]() |
| Temperature on processor | ![]() |
![]() |
| the temperature on the processor (local) | ![]() |
![]() |
| Temperature of fins | ![]() |
![]() |
| Temperature of Base | ![]() |
![]() |
CONCLUSION:
| CASES | VELOCITY(m/s) | TOTAL TEMPERATURE OF GRAPHICS CARD(K) | TOTAL HEAT TRANSFER COEFF ON GRAPHICS CARD (W/m^2K) |
| CASE 1 | 2 | 773 | 1030 |
| CASE 2 | 5 | 583 | 1030 |
| CASE 3 | 1 | 1070 | 1030 |
| BASELINE MESH (part 2) | 1 | 1040 | 1030 |
- Higher velocity in a particular region means a higher Reynolds number. That’s why the heat transfer coefficient in that area is highest, which means the maximum amount of heat transfer is taking place from fluid to the solid in that region. This also results in a higher temperature of solid in that location.
- Heat transfer coefficient is a function of properties of the fluid at film temperature, temperature difference, temperature coefficient, buoyance force et, hence, mesh resolution near walls usually has the biggest impact on numerical results.
- For the turbulent models, we have to take care of the assumptions and the boundary conditions you put in the program. The mesh is a very important parameter to get nice results so we have to refine it in the important place of our drawing.
- Some factors that should be considered which the most significant is the turbulent boundary layer. If we are using any kind of low Reynolds turbulence model considering enhanced wall treatment (as your K-w SST model), so we need to make sure that we stay in the laminar sub-layer region where velocity profiles are assumed to be laminar and viscous stress dominates the wall shear which means
- Mesh/ grid dependency test is very important to get confidence over results.

















