Week 6.1 - Setting up a model (Electronic enclosure)

Dear Sir,

Please find enclosed PDF attachment for 6.1 Week challenge. Report comprises of Aim & introduction followed with every step screen shot and explaination for Spaceclaim, Coarse mesh, Multi-level Meshing, Thermal properties for heat dissipation components, Assigning monitor points, Problem setup, Solution setting, Solve: run Solution, Examining all graphs & summary results followed with Cut-Plane temperature contours & Vectors & Object Face: Temperature contours for heat sink.

thanks

Kind Regards,

Deepak Bhangadia