Conjugative Heat Transfer Analysis On a Graphics Card by using ANSYS Fluent

A Conjugative Heat Transfer Analysis On a Graphics Card by using ANSYS Fluent:

Introduction about graphics card:

The graphics card is an electronic device, it is made up of fabric glass F-4, etc. The processor is placed at the top surface of the graphics card. In this case, the processor generates heat while doing the operations. This heat can reduce by providing the fines at the top surfaces of the processer. The incoming air flows over the fines this can carry all the generated heat, in that case, the heat transfer can take places by convection.

In this case, we analyze how the processer effect the base. We use base material is Bakelite.

Assumptions:

1. The heat dissipation from the processer is 5w.

2. The dimensions of the processer are in (8*8*1)mm.

3. The total heat generated by the processor is = Total heat dissipation from the processer / Dimensions of the processer.

= 5/(8*8*1)^-9

= 78125000 w / m^3

Inlet velocity = 3 m/s

Inlet temperature = 300 K

Materials used and their properties:

Fines: Aluminium

Density=2719 Kg/m^3

(specific heat) cp=871 j/kg-k

Thermal conductivity=202.4 w/m-k

Processer: Gold

Density=19320 Kg/m^3

(specific heat) cp =129.81 j/kg-k

Thermal conductivity =16.27 w/m-k

Base: Bakelite

Density =1.3 g/cm^3 =1300 Kg/m^3

(specific heat) cp =381 j/kg-k

Thermal conductivity =0.2 w/m-k

Geometry:

1. Mesh size: Base mesh:

Cut section:

Mesh details:

Heat generated source:

Residuals:

The above figure shows the residuals of the base mesh after 150 iterations of the flow maintenance constant.

Velocity polt:

Pressure polt:

Temperature:

Maximum temperature 3.39e+2 & Minimum temperature 3.00e+2

Wall heat transfer coefficient of the model:

Maximum heat transfer coefficient 1.179e+3.

2.Mesh size 2 mm :

Mesh details:

Residuals:

Velocity polt:

Pressure polt:

Temperature:

Maximum temperature 3.16e+2 and minimum temperature 3e+2.

Wall heat transfer coefficient:

Maximum heat transfer coefficient 1.204e+3

Conclusion:

1. The maximum temperature attained by the processor at base mesh is 3.3567e+2 and mesh size 2mm is 3.348e+2 k.

2. The maximum wall heat transfer coefficient at base mesh is 1.1974e+3 and mesh size 2mm is 1.204e+03 Wm^-2k^-1.

3. After comparing both the results we conclude the number of elements is more, in that case, more accurate results are getting.

Animation: