Conjugate Heat Transfer Analysis on a graphics card using Ansys Fluent
Objective:
Perform a steady-state conjugate heat transfer analysis on a model of a graphics card.
- Find out the maximum temperature attained by the processor.
- Prove that the simulation has achieved convergence with appropriate images and plots.
- Find out the heat transfer coefficient at appropriate areas of the model.
- Identify potential hotspots on the model.
CHT analysis:
The model of computer graphics card is imported in Ansys Space claim. Fluid volume is created by creating an enclosure around the graphics card. Share topology is enabled for conformal mesh.
Meshing:
Case 1 ( Baseline)
Element size:0.005m
Number of elements:49282
Number of nodes:9464
Case 2 (Refined)
Element size:0.003m
Number of elements:226336
Number of nodes:41170
Body sizing is given to solid bodies
Element size:0.001m
After meshing it\'s solved using fluent.
Solver: Pressure based steady-state solver
Turbulence model: k epsilon
Material:
Fluid volume - Air
Graphics card base - Copper
Processor- Gold
Fins - Aluminum
(Since Zn is not available in Ansys academic version material for processor is assumed as Au)
Boundary conditions
Inlet: Velocity inlet
Inlet velocity=5m/s
Outlet: Pressure outlet
In this simulation processor is the heat source. And assuming the power of the graphics card as 13 W. The heat generated is 203125 W/m^3.
Case 1 - Residual plot
The solution is converged after 300 iterations.
Case 2 - Residual plot
Solution is converged after 100 iterations.
Result:
Case-1
Temperature plot on cut plane z
Wall heat transfer coefficient plot
Temperature plot on graphics card
Case 2
Temperature plot on cut plane z
Wall heat transfer coefficient plot
Temperature plot on graphics card
- Maximum temperature attained by the processor=290.1 K
- In the flow recirculation region, the temperature is high. Because velocity is low and heat transfer due to convection is low. This region is the potential hotspot. Any component placed here may fail due to high temperature.