Project 2 - SiC/IGBT isolated gate driver reference design with thermal diode and sensing FET
1. Layer stack-up can be derived from the number of layers, the arrangement of layers, manufacturability, copper thickness, impedance requirement, Board thickness, and via types.
2. Width[mils] = Area[mils^2]/(Thickness[oz]*1.378[mils/oz]) where 1.378 is associated with the standard 1 ounce pour thickness.
3. methods to avoid heating of component in 1 4 layer PCB are
- Copper thickness and width of traces.
- Pad design for PCB thermal management.
- Placing of high power components in PCB.
- Thermal vias in PCB design.
- Heat sink.
- Heat pipe integration.
- Thicker PCB boards.
- Integrated cooling methods.
4. Multilayer boards by their innate electrical properties provide high capacity and high speed in a smaller footprint. Higher density of assembly. Connectors required for multiple separate PCBs are reduced or eliminated, simplifying construction and further reducing weight