Challenge

Project 2 - SiC/IGBT isolated gate driver reference design with thermal diode and sensing FET

1. How will you decide the layer stackup ?

Planing the optimal number of layers stack up is one of the most important phases in PCB desing. Layer stackups depends on designer experience and too many factors such as:

  • PCB stackup
  • PCB manufacturing technolgy
  • VIAs
  • Minimum Track Width
  • Clearances
  • Number of components
  • Placment of components

However, based on what I learned throughout the course I would do the following:

  • Starting with TOP&BOTTOM signal Layers
  • If the design has too many connections, two more inner signal layers will be added and I will try to fit everythin into these four layers.
  • If I noticed I need more space I will try to rearrange the components
  • If it didnt work I will add two more layersHow do you calculate the trace width, via size and trace length.

2. How do you calculate the trace width, via size and trace length ?

For calculation I will rely on open source calculators that follows IPC standards such as the one mentioned in the course "SATURN PCB DESING TOOL KIT"

2a. Calculating Trace Width and & Trace Length

Trace width and length mainly depends current flowing throut the trace, For calculating the trace width and length I will use the "Conductor Properties" tap and I will try to select the most optimezed width and length that can carry the required current and other factors.

2b. Calculating Via Size

Via Size can also be calculated using the "Via Properties" tap, I will also try to select the most optimezed via size that can carry the required current and other factors.

3. What will you do to avoid heating of component in a 4 layer PCB ?

  • Sufficient trace width and thickness. Since the resistance of copper accounts for power loss and heat.
  • Sufficient thermal pad design
  • Placment of high power component should be at the middle of the PCB. If its placed near the edges, heat will accumlate at the edge.
  • Using heat sink
  • Preventing solder from flowing down the vias

4. Advantage of multilayer PCB ?

  • Small Size
  • Lightwight Construction
  • High Durabitily
  • Less noise
  • High density assemblies
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