Project

Static Structural Analysis of Iphone bending using ANSYS WORKBENCH

Objective: Performing Static Structural Analysis of Iphone bending under different conditions and comparing results.

Setup:

Geometry:

Bodies with Stiffness behaviour as Rigids

Bodies with Stiffness behaviour as Flexible

Contacts:

Bonded for Display to Frame

Frictionaless for rest of contacts

Joints:

Fixed Body-Ground

Translational Body-Ground

Mesh:

Face sizing 4 mm for bottom part of frame and contact finger faces and rest is default

Analysis settings:

Fixed support

Fixed support is given at two faces of frame to fix it and restrict motion of flying of Iphone

Displacement

Displacment along x and z is fixed so that movement of frame is only along y direction

Joint load of Displacement

Displacment of 8 mm is given with retracting the fingers back to original position with 0 mm

Materials:

Display is made of Glass. Frame is of Aluminum Alloy NL. Inside is of Polyethylene and rest is of Structural steel.

S-N curve data:

Solution:

Case 1:

Directional deformation

Min. value = -0.8496 mm , Max. value = 8 mm

Equivalent stress:

Min. value = 4.09e-7 MPa , Max. value = 3092.3 MPa

Safety factor:

Life:

Case 2:

Shifting bottom fingers to x=22.5 mm z=10 mm

Directional deformation along Y axis:

Min. value = -0.4800 mm , Max. value = 8 mm

Equivalent stress:

Min. value = 4.09e-7 MPa , Max. value = 1781.7 MPa

Safety factor:

Life:

Comparing results in Tabular form:

Cases

Directional deformation along Y axis in mm

Equivalent stress in MPa

Safety factor Max

Min

Max

Min

Max

Case 1

-0.8496

8

4.09e-7

3092.3

0.1330

Case 2

-0.4800

8

1.98e-4

1781.7

0.2198

Conclusion:

After comparing results for case 1 and 2 , we can can conclude that Case 2 on which the Bottom fingers at place at origin gives better stress value due to uniform distribution of stress on Iphone . Also Safety facor with maximum value is obtained in Case 2.

Therefore, we can say that Case 2 gives better result as compared to Case 1 due to its uniform distribution of stress throughout Iphone and better Safety factor.

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