Mid Surface extraction and meshing of an IP substrate
Objective-: To obtain the mid-surface and mesh the geometry.
Procedure-: Geometry of this complex features first should be divided into different PID's and mid surface should be obtained.
1. Before dividing the geometry into PID's, the topological clean up should be performed.
2. If there are any errors showing, then those should be taken care of accordingly.
3. While dividing the geometry into parts care should be taken, because a part can be assigned with different PIDs.
4. After geometry is divided into different parts, the mid surface can be extracted individually.
5.Mid surface extraction for each geometry can be done by either offset option or middle option under the faces tab.
6. After obtaining the mid surface of each PID, these can be checked again with geometry checks option to look for geometric errors.
7. After done with the extraction of mid surface and geometry checks, the next step is meshing.
8. Each and every PID should mesh individually and then join separately.
9. Before meshing starts, meshing parameters and QC inputs should be given as desired.
10. For meshing each mid surface we can use batch mesh or spot mesh or gradual meshing options.
11. Each mid surface can be meshed using batch meshing.
12. After meshing, each surface should be checked for off elements, for each off element depending upon the failure criteria steps should be taken to clear errors.
13. After meshing each PID individually should be joined to one another.
14. To join these FE structures individually, first, these have to be released from geometry.
15. These FE structures can be joined using the paste option, under that node sets option.
16. Selecting each individual node can be tedious, hence we can use the path line option while selecting the whole set of nodes.
17. If there is any discrepancy of elements, distorted elements can be deleted and the gap can be filled accordingly.
Result:- Completely meshed IP substrate part is obtained with the desired quality criteria.