Electronic Cooling Simulations using ANSYS ICEPAK

ANSYS ICEPAK is a powerful CFD suite, enabling multiphysics coupling between electrical, thermal, and mechanical analyses for electronics design. It is integrated in ANSYS Workbench for coupling with MCAD, thermal–stress analysis, with ANSYS Mechanical, and advanced post-processing via ANSYS CFD-Post.

  • 0% EMI Option Available
  • Domain : CFD
  • Pre-requisites : For Mechanical, Electrical & Electronics Engineers
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A Quick Overview

ANSYS ICEPAK is a powerful CFD suite, enabling multiphysics coupling between electrical, thermal, and mechanical analyses for electronics design. It is integrated with ANSYS Workbench for coupling with MCAD, thermal–stress analysis, with ANSYS Mechanical, and advanced post-processing via ANSYS CFD-Post. 
At the end of this course, you will be able to understand how to provide effective cooling and how to model and treat the electronic systems manually on ICEPAK. 
There is a huge scope for electronic cooling engineers as they should have a basic knowledge of electronic devices and also in CFD leading to a high demand in the industry.


Get a 1-on-1 demo to understand what is included in the course and how it can benefit you from an experienced sales consultant. The demo session will help you enroll in this course with a clear vision and confidence.

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1Week 1 : Introduction to Electronics Cooling

This session gives you a basic understanding of heat transfer in electrical and electronics cooling. The introduction to all the passive and active electronic systems and their considerations in doing simulations are explained.

  • Thermal problems and challenges in electrical and electronics

  • When to do thermal analysis

  • Basics of heat transfer in electronics

  • Analogy - electrical vs. thermal

  • Thermal resistance and capacitance

  • Thermal management at different levels – component/chip/package level, board level, and system level

  • Different components in electronics

  • Process of solving thermal issue using ICEPAK

  • Most influential factors in thermal management of electronics

  • Overview of Ansys ICEPAK (Software introduction)

2Week 2 : ICEPAK Model Building

This session helps you to build thermal models of electronic devices using ICEPAK primitive shapes. Also it provides an introduction to the whole layout of the software platform and helps you get familiar with it.


  • Thermal simulation approach
  • Different primitives and compound objects in ICEPAK with their uses in the thermal model
  • Building the first project in ICEPAK
  • Geometry creation using ICEPAK to capture geometric information, material properties, and boundary conditions
  • Priorities of objects
  • Setting up the first problem
  • Meshing
  • Solving the first problem
  • Checking the convergence
  • Post-processing and interpretation of results

3Week 3 : Meshing Techniques

In this module of the course, you will learn more about meshing the created geometry and the use of different meshing techniques. Upon completion of this module, you will be able to do the following:


  • Conformal meshing
  • Non- conformal meshing
  • Cold-plate model with non-conformal meshing
  • Zero slack with non-conformal meshing
  • Multi-level meshing
  • Mesh and model enhancement exercise
  • Global refinement for a hex-dominant mesh
  • Best practices for meshing complex geometries
  • Hands-on meshing examples and home works


4Week 4 : Natural Convection

In this module, you will learn how to simulate natural convection problems. Also, the effect of cabinet size on the natural convection problem and setup considerations are discussed briefly. Some of the topics covered in this module include:

  • Basics of natural convections

  • Basics of buoyancy effect

  • Design of thermal system for best use of natural convections

  • Compare design alternatives

5Week 5 : Forced Convection

In this module, you will learn how to simulate forced convection problems. A brief intro on the fan curve, blade angle, and its impact on cooling due to swirl are discussed. Some of the topics covered in this module include:

  • Basics of forced convections

  • Uses of Heat Sink

  • Understand Heat pipes Modeling and Nested Non-Conformal Meshing

  • Choose a pump, fan, fluid mover to perform adequate fluid flow rate

  • Hands-on examples and homework

6Week 6 : Heat Generation

In this lecture, You will be able to understand the Joule heating effect and the types of heat source profiles that can be provided in ICEPAK. Upon completion of this lecture, you will be able to

  • Analyze heat generation due to Joule heating in electronic and electrical device

  • PCB modeling: compact and detailed modeling

  • Analyze trace heating in PCB in electronics

  • Perform board-level electrothermal coupling

  • Hands-on examples and homework

7Week 7 : CAD Imports

ICEPAK has the capability to import geometries from various CAD softwares, The geometries will be cleaned up and then converted into primitive shapes of ICEPAK based on the requirement and imported. In this module, you will understand


  • CAD and ECAD import options within ICEPAK
  • Design modeler/SpaceClaim
  • Translation of MCAD geometry to ICEPAK native geometry
  • Hands-on examples and homework


8Week 8 : Radiation Modeling

Radiation modeling is an important phenomenon in electronics cooling. The types of radiation models available and the effect of each model are discussed briefly on this module. Upon completing this module, you will be able to comprehend

  • When to include radiation model (T^4)

  • Different radiation models in ICEPAK

  • User input properties and parameters

  • Solar radiation / flux calculator

  • Hands-on examples and homework

9Week 9 : Post-processing

Understand how to utilize ANSYS ICEPAK to obtain useful post-processing results. You will learn how to get engineering quantities from your CFD simulation, learn to create cut-planes, streamlines, and much more.


  • Vector plots
  • Streamlines
  • Contours
  • Section planes
  • Various post-processing methods and plots
  • Reporting results
  • Hands-on examples and homework



10Week 10 : Advanced Simulations

In this lecture, you will be able to use ICEPAK to solve some of the advanced and complex problems. The setup procedures to be followed during transient simulations and many advanced methods are discussed briefly.

  • Analyze transient simulations

  • Understand zoom-in modeling approach in ICEPAK

  • Use of advanced methods in projects

  • Hands-on examples and homework

11Week 11 : Macros

Macros are used to fast-build ICEPAK models. In this session, you will learn to use some of the macros available in ICEPAK. Productivity macros are useful for model validation and performing routine tasks: automatic meshing, find zero-slack assemblies, copy assembly mesh settings, debug divergence, delete unused materials/parameters, and so on.


  • JEDEC Test Chambers - Natural convection and forced convection
  • PCB
  • Detailed heat sink
  • Datacenter components
  • Create bonding wires


12Week 12 : Optimization

In this lecture you will be able to use ICEPAK dynamic-Q optimization method to solve design optimization problems. Such problems occur frequently in engineering applications where time-consuming numerical simulations may be used for function evaluations. By the end of this module, you will be able to comprehend

  • When to use optimization

  • Defining design variables and a parametric study in ICEPAK

  • Setting up & running trials

  • Define parametric runs and assign primary functions

  • Function reporting and plotting


  • Students who know the theory behind CFD and want to implement the concepts
  • Design engineers, manufacturing engineers, or any other engineer working in a non-CFD domain who choose to specialize in the CFD domain
  • Students who are passionate about Thermal Systems and Fluid mechanics
  • Students who are pursuing MTech or MS in a “Non-CFD “ field and want to increase their profile by learning how to work on CFD



ANSYS ICEPAK is a powerful CFD suite that allows engineers to model electronic system designs, perform heat transfer, and fluid flow simulations. ICEPAK combines advanced solver technology with robust, automatic meshing to help you rapidly perform heat transfer and fluid flow simulation.


SpaceClaim helps in preparing CAD models for CFD Analysis and converting them into primitive CAD shapes that ICEPAK can recognize through various levels of conversion.

Flexible Course Fees

Choose the plan that’s right for you


2 Months Access


Per month for 3 months

  • Access Duration : 2 months
  • Mode of Delivery : Online
  • Project Portfolio : Available
  • Certification : Available
  • Email Support : Available
  • Forum Support : Available

Lifetime Access


Per month for 3 months

  • Access Duration : Lifetime
  • Mode of Delivery : Online
  • Project Portfolio : Available
  • Certification : Available
  • Individual Video Support : 12/month
  • Group Video Support : 12/month
  • Email Support : Available
  • Forum Support : Available
  • Telephone Support : Available
  • Dedicated Support Engineer : Available

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Frequently Asked Questions

1Who are the instructors and what is the learning process?

Our instructors are industry experts working in Fortune 500 companies. We partner with them to deliver the lectures online. You will be given access to recorded content and assignments each week.

2Are there any prerequisites for this course?

This course is for the engineering students (BE, B Tech and M Tech), freshers and professionals who have little to no experience in electronics cooling simulations with ANSYS ICEPAK. The prerequisite for this course requires knowledge in heat transfer and fluid dynamics. Students should have access to ANSYS ICEPAK.

3What kind of support I can expect? What if I have doubts?

Our support system is amazing!. You can read our reviews on Google to see this. We focus on one-on-one support which no one else does. We will communicate with you through videoconferencing, WhatsApp messages/calls, individual online sessions and also in person. Doubts and queries are addressed by a dedicated support engineer who is assigned to you to walk you through your problem areas and clarify any queries that you may have.

4How is this different from what I learnt in college?

Our courses are crafted after consultation with industry experts. This gives you the opportunity to apply what you have learned only as theory and work on projects that will give you a leg up in your career aspirations - be it an MS admit, a new job or growth within your organization. This course will help you bridge the gap between academia and industry and get you market-ready.

5What advantages will I gain by taking this course?

The course covers several phases ranging from understanding the physics of problem, thoughts on simulation method, geometry model building of electronic part, meshing of geometry, problem setup and boundary conditions, solution, results and visualization to quantitative post-processing.

You will have an edge over your peers by working extensively on industry-relevant projects, practice on tools and software that will set you apart and help you in getting ahead of the competition. Our course will strengthen your portfolio to get better grants and scholarship opportunities for MS Admits, explore options in Research & Development, and land that much-coveted job in top core companies. 

6What are the real world application for the tools and techniques that you will teach in this course?

Some of the real world applications of what we cover in this course include: Thermal simulation of Heat generation in electrical components due to joule losses. PCB thermal simulations, Force and natural convections, conduction and radiation.

7Which companies use these techniques and for what?

Some of the popular companies that uses these tools include Schneider Electric, Cisco, Apple, Altair, L&T, NVIDIA, Intel, ABB, Philips, etc.

8How is this course going to help me get a job?

If you are thermal analyst or you want to be, then with these competencies you will have more demand in electrical and electronic industries. An expert in thermal simulation will definitely secure the job as there are very few experts available in the market. 

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