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Electronic Cooling Simulations using ANSYS ICEPAK in Mumbai

ANSYS ICEPAK is a powerful CFD suite, enabling multiphysics coupling between electrical, thermal, and mechanical analyses for electronics design. It is integrated in ANSYS Workbench for coupling with MCAD, thermal–stress analysis, with ANSYS Mechanical, and advanced post-processing via ANSYS CFD-Post.

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Syllabus

This course is full of best-in-class content by leading faculty and industry experts in the form of videos and projects

Course Overview

  • This course introduces students to the GUI-based CFD tool - ICEPAK, which is used for thermal management of Electronic components.
  • The student will gain knowledge on how to model thermal heat transfer happening in electronic components.
  • The student will also learn how to model various modes of heat transfer predominant in the electronics industry. 
  • By the end of this course, students would be able to perform any generic Electronic Cooling simulation using ICEPAK.

Course Syllabus in Mumbai

On a daily basis we talk to companies in the likes of Tata Elxsi and Mahindra to fine tune our curriculum.

Week 1 - Introduction to Electronics Cooling

  • This session gives you a basic understanding of heat transfer in electrical and electronics cooling. The introduction to all the passive and active electronic systems and their considerations in doing simulations are explained.
    • Thermal problems and challenges in electrical and electronics
    • When to do thermal analysis
    • Basics of heat transfer in electronics
    • Analogy - electrical vs. thermal
    • Thermal resistance and capacitance
    • Thermal management at different levels – component/chip/package level, board level, and system level
    • Different components in electronics
    • Process of solving thermal issue using ICEPAK
    • Most influential factors in thermal management of electronics
    • Overview of Ansys ICEPAK (Software introduction)

Week 2 - ICEPAK Model Building

  • This session helps you to build thermal models of electronic devices using ICEPAK primitive shapes. Also, it provides an introduction to the whole layout of the software platform and helps you get familiar with it. 
    • Thermal simulation approach
    • Different primitives and compound objects in ICEPAK with their uses in the thermal model
    • Building the first project in ICEPAK
    • Geometry creation using ICEPAK to capture geometric information, material properties, and boundary conditions
    • Priorities of objects
    • Setting up the first problem
    • Meshing
    • Solving the first problem
    • Checking the convergence
    • Post-processing and interpretation of results

Week 3 - Meshing Techniques

  • In this module of the course, you will learn more about meshing the created geometry and the use of different meshing techniques. Upon completion of this module, you will be able to do the following: 
    • Conformal meshing
    • Non- conformal meshing
    • Cold-plate model with non-conformal meshing
    • Zero slack with non-conformal meshing
    • Multi-level meshing
    • Mesh and model enhancement exercise
    • Global refinement for a hex-dominant mesh
    • Best practices for meshing complex geometries
    • Hands-on meshing examples and home works

Week 4 - Natural Convection

  • In this module, you will learn how to simulate natural convection problems. Also, the effect of cabinet size on the natural convection problem and setup considerations are discussed briefly. Some of the topics covered in this module include:
    • Basics of natural convections
    • Basics of the buoyancy effect
    • Design of a thermal system for best use of natural convections
    • Compare design alternatives

Week 5 - Forced Convection

  • In this module, you will learn how to simulate forced convection problems. A brief intro on the fan curve, blade angle, and its impact on cooling due to swirl is discussed. Some of the topics covered in this module include:
    • Basics of forced convections
    • Uses of Heat Sink
    • Understand Heat pipes Modeling and Nested Non-Conformal Meshing
    • Choose a pump, fan, fluid mover to perform an adequate fluid flow rate
    • Hands-on examples and homework

Week 6 - Heat Generation

  • In this lecture, You will be able to understand the Joule heating effect and the types of heat source profiles that can be provided in ICEPAK. Upon completion of this lecture, you will be able to
    • Analyze heat generation due to Joule heating in electronic and electrical devices
    • PCB modeling: compact and detailed modeling
    • Analyze trace heating in PCB in electronics
    • Perform board-level electrothermal coupling
    • Hands-on examples and homework

Week 7 - CAD Imports

  • ICEPAK has the capability to import geometries from various CAD software, The geometries will be cleaned up and then converted into primitive shapes of ICEPAK based on the requirement and imported. In this module, you will understand
    • CAD and ECAD import options within ICEPAK
    • Design modeler/SpaceClaim
    • Translation of MCAD geometry to ICEPAK native geometry
    • Hands-on examples and homework

Week 8 - Radiation Modeling

  • Radiation modeling is an important phenomenon in electronics cooling. The types of radiation models available and the effect of each model are discussed briefly in this module. Upon completing this module, you will be able to comprehend
    • When to include radiation model (T^4)
    • Different radiation models in ICEPAK
    • User input properties and parameters
    • Solar radiation / flux calculator
    • Hands-on examples and homework

Week 9 - Post-processing

  • Understand how to utilize ANSYS ICEPAK to obtain useful post-processing results. You will learn how to get engineering quantities from your CFD simulation, learn to create cut-planes, streamlines, and much more. 
    • Vector plots
    • Streamlines
    • Contours
    • Section planes
    • Various post-processing methods and plots
    • Reporting results
    • Hands-on examples and homework

Week 10 - Advanced Simulations

  • In this lecture, you will be able to use ICEPAK to solve some of the advanced and complex problems. The setup procedures to be followed during transient simulations and many advanced methods are discussed briefly.
    • Analyze transient simulations
    • Understand zoom-in modeling approach in ICEPAK
    • Use of advanced methods in projects
    • Hands-on examples and homework

Week 11 - Macros

  • Macros are used to fast-build ICEPAK models. In this session, you will learn to use some of the macros available in ICEPAK. Productivity macros are useful for model validation and performing routine tasks: automatic meshing, finding zero-slack assemblies, copying assembly mesh settings, debugging divergence, deleting unused materials/parameters, and so on. 
    • JEDEC Test Chambers - Natural convection and forced convection
    • PCB
    • Detailed heat sink
    • Datacenter components
    • Create bonding wires

Week 12 - Optimization

  • In this lecture, you will be able to use ICEPAK dynamic-Q optimization method to solve design optimization problems. Such problems occur frequently in engineering applications where time-consuming numerical simulations may be used for function evaluations. By the end of this module, you will be able to comprehend
    • When to use optimization
    • Defining design variables and a parametric study in ICEPAK
    • Setting up & running trials
    • Define parametric runs and assign primary functions
    • Function reporting and plotting

Our courses have been designed by industry experts to help students achieve their dream careers

Industry Projects in Mumbai

Our projects are designed by experts in the industry to reflect industry standards. By working through our projects, Learners will gain a practical understanding of what they will take on at a larger-scale in the industry. In total, there are 3 Projects that are available in this program.

Modeling & Analysis of Low Voltage Control Panel

In this project, the student will learn how to model and find the temperature distribution of a Low Voltage Control Panel, which is widely found in large buildings and industries to distribute electrical power.

PCB Thermal Analysis

In this project, the student will simulate the conductive and convective heat transfer taking place during the working of a general Printed Circuit Board (PCB).

Modeling & Analysis of a Datacenter

In this project, the student will model a datacenter/server room and analyze the temperature distribution of the same using Ansys ICEPAK.

Our courses have been designed by industry experts to help students achieve their dream careers

Ratings & Reviews by Learners

Skill-Lync has received honest feedback from our learners around the globe.

Google Rating
4.8

Build Your Expertise with Skill-Lync’s Electronic Cooling Simulations using ANSYS ICEPAK Course in Mumbai

This CFD course in Mumbai by Skill-Lync has been curated to teach you about electronic cooling simulations. It will also help you learn how to use CFD tools like ICEPACK to resolve real-world issues.

The Electronic Cooling Simulations using ANSYS ICEPAK Course in Mumbai

A CFD certification course helps you understand how to test the air-cooling performance of electronic cabinets that involves forced convection. The process includes complex concepts like 3D viscous flow problems coupled with heat transfer and solid-fluid mediums.

That is why Skill-Lync has designed a comprehensive program to introduce you to the domain. The 12-week-long course helps you gain a basic understanding of ANSYS ICEPACK. The CFD tool is prevalently used to enable Multiphysics coupling between thermal, mechanical, and electrical analyses for electronics designs.

Skill-Lync assigns multiple industry experts in its CFD certification course, helping you gain domain-relevant knowledge and skills. The experts will guide you through three industry-grade projects involving “modelling and analysis of low voltage control panel”, “PCB thermal analysis”, and “modelling and analysis of a datacentre.”

After completing the online mechanical engineering course with Skill-Lync, you can leverage these skills to achieve concrete results.

FAQs about the Electronic Cooling Simulations using ANSYS ICEPAK Course in Mumbai

Why should I pursue the Electronic Cooling Simulations using ANSYS ICEPAK course in Mumbai?

You should opt for this CFD course to learn about thermal problems and the challenges faced in the electronics domain. It will also shed light on different components and processes being used in the thermal management of electronics. You will also learn what CFD is and how it is useful for industries.

Who should enrol in Skill-Lync’s Electronic Cooling Simulations using ANSYS ICEPAK course in Mumbai?

The program is beneficial for engineers interested in learning about ICEPACK and its uses with ANSYS Mechanical and ANSYS CFD-Post. You can enrol in this course if you have a background in electrical, electronics, or mechanical engineering.

What is the benefit of choosing this Electronic Cooling Simulations using ANSYS ICEPAK course in Mumbai?

Pursuing a course at Skill-Lync would offer many benefits to you.

  • Industry-oriented curriculum.
  • Hands-on experience in solving industry projects.
  • Email and forum support from the technical support team to clear your doubts.
  • A certificate of completion for all participants and a merit certificate for the top 5% of the scorers.

What is the fee for Skill-Lync’s Electronic Cooling Simulations using ANSYS ICEPAK course in Mumbai?

Skill-Lync offers three options for enrollment in this online mechanical engineering course: Basic, Pro, and Premium. The basic plan provides you with two months of access at INR 7000 per month for three months, the Pro plan provides you with four months of access at INR 10,000 per month for three months and the Premium plan provides you lifetime access at INR 15,000 per month for three months.

What are the career prospects after completing the Electronic Cooling Simulations using ANSYS ICEPAK course by Skill-Lync?

You can apply for positions such as:

  • Thermal design engineer
  • Electronics motors simulation engineer
  • Advanced R&D engineer - Thermal

What is the average salary you get after completing Skill-Lync’s Electronic Cooling Simulations using ANSYS ICEPAK course in Mumbai?

According to PayScale, an electronics design engineer can earn an average salary of INR 6 lakhs per annum in India.

Can you tell me more about Skill-Lync?

Skill-Lync is among India's leading EdTech platforms dedicated to transforming engineering education. We equip young engineers with the latest skill sets and cutting-edge tools in new-age technologies.

The brainchild of two engineers, Skill-Lync, is on a mission to bridge the skill gap between aspiring professionals and the industry's demands through job-oriented courses.

Flexible Pricing

Talk to our career counsellors to get flexible payment options.

Premium

INR 40,000

Inclusive of all charges


Become job ready with our comprehensive industry focused curriculum for freshers & early career professionals

  • 1 Year Accessto Skill-Lync’s Learning Management System (LMS)

  • Personalized Pageto showcase Projects & Certifications

  • Live Individual & Group Sessionsto resolve queries, Discuss Progress and Study Plans.

  • Personalized & Hands-OnSupport over Mail, Telephone for Query Resolution & Overall Learner Progress.

  • Job-Oriented Industry Relevant Curriculumavailable at your fingertips curated by Global Industry Experts along with Live Sessions.

Instructors profiles

Our courses are designed by leading academicians and experienced industry professionals.

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1 industry expert

Our instructors are industry experts along with a passion to teach.

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10 years in the experience range

Instructors with 10 years extensive industry experience.

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Areas of expertise

  • Engine & Emission Control

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