This session gives you a basic understanding of heat transfer in electrical and electronics cooling. The introduction to all the passive and active electronic systems and their considerations in doing simulations are explained.

• Thermal problems and challenges in electrical and electronics

• When to do thermal analysis

• Basics of heat transfer in electronics

• Analogy - electrical vs. thermal

• Thermal resistance and capacitance

• Thermal management at different levels – component/chip/package level, board level, and system level

• Different components in electronics

• Process of solving thermal issue using ICEPAK

• Most influential factors in thermal management of electronics

• Overview of Ansys ICEPAK (Software introduction)

This session helps you to build thermal models of electronic devices using ICEPAK primitive shapes. Also it provides an introduction to the whole layout of the software platform and helps you get familiar with it.

• Thermal simulation approach
• Different primitives and compound objects in ICEPAK with their uses in the thermal model
• Building the first project in ICEPAK
• Geometry creation using ICEPAK to capture geometric information, material properties, and boundary conditions
• Priorities of objects
• Setting up the first problem
• Meshing
• Solving the first problem
• Checking the convergence
• Post-processing and interpretation of results

In this module of the course, you will learn more about meshing the created geometry and the use of different meshing techniques. Upon completion of this module, you will be able to do the following:

• Conformal meshing
• Non- conformal meshing
• Cold-plate model with non-conformal meshing
• Zero slack with non-conformal meshing
• Multi-level meshing
• Mesh and model enhancement exercise
• Global refinement for a hex-dominant mesh
• Best practices for meshing complex geometries
• Hands-on meshing examples and home works

In this module, you will learn how to simulate natural convection problems. Also, the effect of cabinet size on the natural convection problem and setup considerations are discussed briefly. Some of the topics covered in this module include:

• Basics of natural convections

• Basics of buoyancy effect

• Design of thermal system for best use of natural convections

• Compare design alternatives

In this module, you will learn how to simulate forced convection problems. A brief intro on the fan curve, blade angle, and its impact on cooling due to swirl are discussed. Some of the topics covered in this module include:

• Basics of forced convections

• Uses of Heat Sink

• Understand Heat pipes Modeling and Nested Non-Conformal Meshing

• Choose a pump, fan, fluid mover to perform adequate fluid flow rate

• Hands-on examples and homework

In this lecture, You will be able to understand the Joule heating effect and the types of heat source profiles that can be provided in ICEPAK. Upon completion of this lecture, you will be able to

• Analyze heat generation due to Joule heating in electronic and electrical device

• PCB modeling: compact and detailed modeling

• Analyze trace heating in PCB in electronics

• Perform board-level electrothermal coupling

• Hands-on examples and homework

ICEPAK has the capability to import geometries from various CAD softwares, The geometries will be cleaned up and then converted into primitive shapes of ICEPAK based on the requirement and imported. In this module, you will understand

• CAD and ECAD import options within ICEPAK
• Design modeler/SpaceClaim
• Translation of MCAD geometry to ICEPAK native geometry
• Hands-on examples and homework

Radiation modeling is an important phenomenon in electronics cooling. The types of radiation models available and the effect of each model are discussed briefly on this module. Upon completing this module, you will be able to comprehend

• When to include radiation model (T^4)

• Different radiation models in ICEPAK

• User input properties and parameters

• Solar radiation / flux calculator

• Hands-on examples and homework

Understand how to utilize ANSYS ICEPAK to obtain useful post-processing results. You will learn how to get engineering quantities from your CFD simulation, learn to create cut-planes, streamlines, and much more.

• Vector plots
• Streamlines
• Contours
• Section planes
• Various post-processing methods and plots
• Reporting results
• Hands-on examples and homework

In this lecture, you will be able to use ICEPAK to solve some of the advanced and complex problems. The setup procedures to be followed during transient simulations and many advanced methods are discussed briefly.

• Analyze transient simulations

• Understand zoom-in modeling approach in ICEPAK

• Use of advanced methods in projects

• Hands-on examples and homework

Macros are used to fast-build ICEPAK models. In this session, you will learn to use some of the macros available in ICEPAK. Productivity macros are useful for model validation and performing routine tasks: automatic meshing, find zero-slack assemblies, copy assembly mesh settings, debug divergence, delete unused materials/parameters, and so on.

• JEDEC Test Chambers - Natural convection and forced convection
• PCB
• Detailed heat sink
• Datacenter components
• Create bonding wires

In this lecture you will be able to use ICEPAK dynamic-Q optimization method to solve design optimization problems. Such problems occur frequently in engineering applications where time-consuming numerical simulations may be used for function evaluations. By the end of this module, you will be able to comprehend

• When to use optimization

• Defining design variables and a parametric study in ICEPAK

• Setting up & running trials

• Define parametric runs and assign primary functions

• Function reporting and plotting