ANSYS ICEPAK is a powerful CFD suite, enabling multiphysics coupling between electrical, thermal, and mechanical analyses for electronics design. It is integrated in ANSYS Workbench for coupling with MCAD, thermal–stress analysis, with ANSYS Mechanical, and advanced post-processing via ANSYS CFD-Post.
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Request a Demo SessionThis session gives you a basic understanding of heat transfer in electrical and electronics cooling. The introduction to all the passive and active electronic systems and their considerations in doing simulations are explained. Thermal problems and challenges in electrical and electronics When to do thermal analysis Basics of heat transfer in electronics Analogy - electrical vs. thermal Thermal resistance and capacitance Thermal management at different levels – component/chip/package level, board level, and system level Different components in electronics Process of solving thermal issue using ICEPAK Most influential factors in thermal management of electronics Overview of Ansys ICEPAK (Software introduction)
This session helps you to build thermal models of electronic devices using ICEPAK primitive shapes. Also it provides an introduction to the whole layout of the software platform and helps you get familiar with it.
In this module of the course, you will learn more about meshing the created geometry and the use of different meshing techniques. Upon completion of this module, you will be able to do the following:
In this module, you will learn how to simulate natural convection problems. Also, the effect of cabinet size on the natural convection problem and setup considerations are discussed briefly. Some of the topics covered in this module include:
Basics of natural convections
Basics of buoyancy effect
Design of thermal system for best use of natural convections
Compare design alternatives
In this module, you will learn how to simulate forced convection problems. A brief intro on the fan curve, blade angle, and its impact on cooling due to swirl are discussed. Some of the topics covered in this module include:
Basics of forced convections
Uses of Heat Sink
Understand Heat pipes Modeling and Nested Non-Conformal Meshing
Choose a pump, fan, fluid mover to perform adequate fluid flow rate
Hands-on examples and homework
In this lecture, You will be able to understand the Joule heating effect and the types of heat source profiles that can be provided in ICEPAK. Upon completion of this lecture, you will be able to
Analyze heat generation due to Joule heating in electronic and electrical device
PCB modeling: compact and detailed modeling
Analyze trace heating in PCB in electronics
Perform board-level electrothermal coupling
Hands-on examples and homework
ICEPAK has the capability to import geometries from various CAD softwares, The geometries will be cleaned up and then converted into primitive shapes of ICEPAK based on the requirement and imported. In this module, you will understand
Radiation modeling is an important phenomenon in electronics cooling. The types of radiation models available and the effect of each model are discussed briefly on this module. Upon completing this module, you will be able to comprehend
When to include radiation model (T^4)
Different radiation models in ICEPAK
User input properties and parameters
Solar radiation / flux calculator
Hands-on examples and homework
Understand how to utilize ANSYS ICEPAK to obtain useful post-processing results. You will learn how to get engineering quantities from your CFD simulation, learn to create cut-planes, streamlines, and much more.
In this lecture, you will be able to use ICEPAK to solve some of the advanced and complex problems. The setup procedures to be followed during transient simulations and many advanced methods are discussed briefly.
Analyze transient simulations
Understand zoom-in modeling approach in ICEPAK
Use of advanced methods in projects
Hands-on examples and homework
Macros are used to fast-build ICEPAK models. In this session, you will learn to use some of the macros available in ICEPAK. Productivity macros are useful for model validation and performing routine tasks: automatic meshing, find zero-slack assemblies, copy assembly mesh settings, debug divergence, delete unused materials/parameters, and so on.
In this lecture you will be able to use ICEPAK dynamic-Q optimization method to solve design optimization problems. Such problems occur frequently in engineering applications where time-consuming numerical simulations may be used for function evaluations. By the end of this module, you will be able to comprehend
When to use optimization
Defining design variables and a parametric study in ICEPAK
Setting up & running trials
Define parametric runs and assign primary functions
Function reporting and plotting
SpaceClaim helps in preparing CAD models for CFD Analysis and converting them into primitive CAD shapes that ICEPAK can recognize through various levels of conversion.
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CFD Engineer Master's Certification Program
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Master's Certification Program in Hybrid Electric Vehicle Design and Analysis
EV Intern (R&D) @ Hero MotorCorp
Our instructors are industry experts working in Fortune 500 companies. We partner with them to deliver the lectures online. You will be given access to recorded content and assignments each week.
This course is for the engineering students (BE, B Tech and M Tech), freshers and professionals who have little to no experience in electronics cooling simulations with ANSYS ICEPAK. The prerequisite for this course requires knowledge in heat transfer and fluid dynamics. Students should have access to ANSYS ICEPAK.
Our support system is amazing!. You can read our reviews on Google to see this. We focus on one-on-one support which no one else does. We will communicate with you through videoconferencing, WhatsApp messages/calls, individual online sessions and also in person.
Doubts and queries are addressed by a dedicated support engineer who is assigned to you to walk you through your problem areas and clarify any queries that you may have.
Our courses are crafted after consultation with industry experts. This gives you the opportunity to apply what you have learned only as theory and work on projects that will give you a leg up in your career aspirations - be it an MS admit, a new job or growth within your organization. This course will help you bridge the gap between academia and industry and get you market-ready.
The course covers several phases ranging from understanding the physics of problem, thoughts on simulation method, geometry model building of electronic part, meshing of geometry, problem setup and boundary conditions, solution, results and visualization to quantitative post-processing.
You will have an edge over your peers by working extensively on industry-relevant projects, practice on tools and software that will set you apart and help you in getting ahead of the competition. Our course will strengthen your portfolio to get better grants and scholarship opportunities for MS Admits, explore options in Research & Development, and land that much-coveted job in top core companies.
Some of the real world applications of what we cover in this course include: Thermal simulation of Heat generation in electrical components due to joule losses. PCB thermal simulations, Force and natural convections, conduction and radiation.
Some of the popular companies that uses these tools include Schneider Electric, Cisco, Apple, Altair, L&T, NVIDIA, Intel, ABB, Philips, etc.
If you are thermal analyst or you want to be, then with these competencies you will have more demand in electrical and electronic industries. An expert in thermal simulation will definitely secure the job as there are very few experts available in the market.
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